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Shenzhen CaiNa Semiconductor Equipment Co., Ltd

Shenzhen,Guangdong,China China

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Accueil Société Shenzhen CaiNa Semiconductor Equipment Co., Ltd Offres de vente

Personne à contacter Jocelyn chou

Nom de la société Shenzhen, Guangdong

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Offres de vente: 4

RFID flip-chip bonging machine
RFID Flip-chip Bonging Machine

RFID flip-chip bonding machine RFM500   Specifications: Dimension: 620mm*650mm*680mm Weight:75K

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RFID flip-chip bonder
RFID Flip-chip Bonder

RF-2000 is a electronic label flip-chip assembly machine, through hot press to solidify and package, roll feed

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RFID testing machine
RFID Testing Machine

TECHNICAL PARAMETERS SPECIFICATION: Dimension:1800mm*700mm*140mm Power:1000w Barometric Pressure:0.1MPa≤

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RFID Flip-chip bonding machinery
RFID Flip-chip Bonding Machinery

RFM1180 flip-chip bonding machinery Machine Structure: 1. Adhesive dispensing: its the same with RF1130, w

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