RFID flip-chip bonder By Shenzhen CaiNa Semiconductor Equipment Co., Ltd, China
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RFID flip-chip bonder

RFID flip-chip bonder

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Personne à contacter Jocelyn

Shenzhen, Guangdong

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Description

RF****0 is a electronic label flip-chip assembly machine, through hot press to solidify and package, roll feeding, automatically pick and paste the chip, auto receiving system, Sophisticated pressure controlling system and tongs can improve the yield of product. It's a high technology equipment concentrated optical, mechanical, electrical, air and liquid fileds. Adaptable for different kinds of electronic label assembling.
Dimension
***0mm***0mm****0mm
Weight
***0 kg
Power
***0 w
Barometric pressure
5 bar≤P≤7 bar
Pressure range
*0—**0g
Accommodated workpiece
antennna ≤**0mm×*0mm
chip 0.4mm×0.4mm~2mm×2mm
Temperature range
*0—**0 ℃
Vision system
Vision position system, chip and antenna automatically positioning
Additional function
Finished label testing system
Throughtout
***0 pcs/hr
Paster accuracy
*5 μm
Substrate Material
PET   PVC   PAPER
Adhesive
ACA   NCA   ICA

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Jocelyn < Shenzhen CaiNa Semiconductor Equipment Co., Ltd >

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