RFID flip-chip bonging machine By Shenzhen CaiNa Semiconductor Equipment Co., Ltd, China
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RFID flip-chip bonging machine

RFID flip-chip bonging machine

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Shenzhen CaiNa Semiconductor Equipment Co., Ltd

Shenzhen CaiNa Semiconductor Equipment Co., Ltd

China

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Personne à contacter Jocelyn

Shenzhen, Guangdong

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Description

RFID flip-chip bonding machine RFM**0

 

Specifications:

Dimension: **0mm***0mm***0mm

Weight:*5KG

Power:**0W

Barometric Pressure: 5 bar≤P≤7 bar

Mechanical Controlling:Anisotropic electro-conductively paste,Manual material loading,Manual Focusing, Manual chip attaching,and transfer to hot-pressing.

Pressure Range;*****0g±1g

Work piece:Antenna≤**0mm**0mm

Chipset 0.3mm*0.3mm*2mm*2mm

Video: One visual orientation system

Bonding Accuracy:±*5um

Substrate Material:PET PVC  PAPER

Glue Type:ACA NCA ICA 

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