Description
RFM***0 flip-chip bonding machinery
Machine Structure:
1. Adhesive dispensing: its the same with RF***0, with fine
adjustment in Z direction. Positioned by a CCD(CAM 1).
2. Chip picking and pasting: Picking operation is the same as
RF****0, with fine adjustment in X, Y, Z three directions, can be
revote in **0 degree in Z direction and with buffer device. Another
CCD here is for the chip positioning.
3. Thermode: Both head of top and base thermode can be heated.
Power source and controlling system is same as RF****0. The
position can be adjusted within **0mm to suit for different width
of antenna.
4. Antenna feeding: Automatically feeding by stepping motor,
positioned by sensor and precise positioned by CCD(CAM 1).
5. Antenna fixing device: There are vacuum holes on the fixing
plate, through CCD( CAM1) to position.
Scheme Draft
Operate instructions
1. Install the adhesive Syringe, adjust the position of the head of
syringe, head of chip picker and the cross curve of the two CCD,
make sure they moves to the same point.
2. Loading the antenna, make sure the material is in the work range
of the machine..
3. Operator adjusts the antenna manually through watching the image
from CCD(CAM 1), precisely position the dispensing point.
4. Start vacuum operation to adsorb the antenna.
5. Operate the chip picker to pick up the chip, through watching
the image from CCD 2 to position the chip.
6. Press the start button, the machine turns into automatic state:
dispensing, pasting chip, then the fixture clamps the antenna, the
stepping motor pulls the antenna to assigned position, the sensor
makes sure the chip is in the range of thermode, then thermode
starts working.(the start button will not work when hot press is
working to avoid the breakdown by misoperation.
7. When thermode is working, operator will operate the next antenna
positioning and chip picking and positioning(thats step 3, 4,
5)
8. Repeat like this, the production is done.
