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Shenzhen,Guangdong,China China
BERGQUIST GPHC3.0, GAP PAD HC 3.0, GAP PAD TGP HC3000 BERGQUIST GAP PAD TGP HC3000 is a soft and compliant gap filling material with a thermal conduc
The true workhorse of the SIL PAD product family, SIL PAD900S AC (BERGQUIST SP900S AC)thermally conductive insulation material is designed for a wide
BERGQUIST Q-Pad 3 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths. SIL PAD T
ERGQUIST SIL PAD TSP PPK900, Polyester-Based, Thermally Conductive Insulation Material BERGQUIST SIL PAD TSP PPK900 Known as BERGQUIST POLY-PAD K-4 BE
BERGQUIST SP1500ST(Thermally Conductive Adhesive Tape)is a fiberglass reinforced thermal interface material that is naturally tacky on both sides. BER
BERGQUIST GPVOUS, Thermal Conductive Sheet, Silica Gel Cooling Pad GAP PAD TGP 1000VOUS, Silicone Thermal Pad For Converter GAP PAD VO Ultra SoftInt
BERGQUIST GAP FILLER TGF 1500 is a two-part, high performance, thermally conductive, liquid gap-filling material, which features exceptional slump res
BERGQUIST POLY-PAD K-10TYPICAL APPLICATIONS Power supplies Motor controls Power semiconductors BERGQUIST SIL PAD TSP PPK1300
Personne àcontacter Carrie Null
Nom de la société Shenzhen, Guangdong
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