Prix FOB
Obtenir le dernier prix1 ~ 2 / Unit
|10 Unit Minimum Order
Pays:
China
N ° de modèle:
GF1500
Prix FOB:
1 ~ 2 / Unit Obtenir le dernier prix
Localité:
USA
Prix de commande minimale:
1 per Unit
Commande minimale:
10 Unit
Packaging Detail:
BOX
Heure de livraison:
3 DAYS
Capacité de Fournir:
1000 Unit per Day
Payment Type:
T/T
Groupe de produits :
Personne àcontacter Carrie
Shenzhen, Guangdong
BERGQUIST GAP FILLER TGF ***0 is a two-part, high performance, thermally
conductive, liquid gap-filling material, which features exceptional slump resistance andÂ
high shear thinning characteristics for optimized consistency and control during dispensing.Â
The mixed system will cure at room temperature and can be accelerated with the
addition of heat. Unlike cured thermal pad materials, a liquid approach offers infinite thicknessÂ
variations with little or no stress to the sensitive components during assembly. BERGQUIST
 GF***0 exhibits low level natural tack characteristics and is intended for use in applicationsÂ
where a strong structural bond is not required. As cured,BERGQUIST Gap Filler ***0 (Two-Part)
provides a soft, thermally conductive,form-in-place elastomer that is ideal for fragile assemblies
 and filling unique and intricate air voids and gaps.
Â
BERGQUIST GF***0Â Typical Applications Include:
• Automotive electronics
• Computers and peripherals
• Between any heat generating semiconductor and a heat sink
• Telecommunications
Configurations Available:
• Supplied in cartridge or kit form
• With or without glass beads
Â
Â
| Pays: | China |
| N ° de modèle: | GF1500 |
| Prix FOB: | 1 ~ 2 / Unit Obtenir le dernier prix |
| Localité: | USA |
| Prix de commande minimale: | 1 per Unit |
| Commande minimale: | 10 Unit |
| Packaging Detail: | BOX |
| Heure de livraison: | 3 DAYS |
| Capacité de Fournir: | 1000 Unit per Day |
| Payment Type: | T/T |
| Groupe de produits : | GAP PAD SERIES |
