Prix FOB
Obtenir le dernier prix1 ~ 2 / Sheet
|5 Sheet Minimum Order
Pays:
China
N ° de modèle:
GPHC3.0
Prix FOB:
1 ~ 2 / Sheet Obtenir le dernier prix
Localité:
USA
Prix de commande minimale:
1 per Sheet
Commande minimale:
5 Sheet
Packaging Detail:
box
Heure de livraison:
-
Capacité de Fournir:
100 Sheet per Week
Payment Type:
T/T
Groupe de produits :
Personne àcontacter Carrie
Shenzhen, Guangdong
BERGQUIST GPHC3.0,GAP PADÂ HC 3.0,GAP PAD TGP HC***0Â
ÂBERGQUIST GAP PAD TGP HC***0 is a soft and compliant gap filling material with a thermal conductivityÂ
Âof 3.0 W/m-K.The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-KÂ
Âfiller package and lowmodulus resin formulation. The enhanced material is ideal for applications requiring
Âlow stress on components and boards during assembly. BERGQUIST GPHC3.0 maintains a conformable
Ânature that allows for quick recovery and excellent wet-out characteristics, even to surfaces with high roughnessÂ
Âand/or topography.
ÂÂ
ÂBERGQUISTÂ GAP PAD HC 3.0 Typical Applications Include:
• Telecommunications
• ASICs and DSPs
• Consumer electronics
• Thermal modules to heat sinks
ÂConfigurations Available:
• Sheet form and die-cut parts
ÂÂ
ÂFor more product information, please feel free to contact us
| Pays: | China |
| N ° de modèle: | GPHC3.0 |
| Prix FOB: | 1 ~ 2 / Sheet Obtenir le dernier prix |
| Localité: | USA |
| Prix de commande minimale: | 1 per Sheet |
| Commande minimale: | 5 Sheet |
| Packaging Detail: | box |
| Heure de livraison: | - |
| Capacité de Fournir: | 100 Sheet per Week |
| Payment Type: | T/T |
| Groupe de produits : | GAP PAD SERIES |
