Prix FOB
Obtenir le dernier prix1 ~ 2 / Piece
|10 Piece Minimum Order
Pays:
China
N ° de modèle:
SP900S
Prix FOB:
1 ~ 2 / Piece Obtenir le dernier prix
Localité:
USA
Prix de commande minimale:
1 per Piece
Commande minimale:
10 Piece
Packaging Detail:
BOX
Heure de livraison:
3 DAYS
Capacité de Fournir:
1000 Piece per Week
Payment Type:
T/T
Groupe de produits :
Personne àcontacter Carrie
Shenzhen, Guangdong
The true workhorse of the SIL PAD product family, SIL PAD**0S AC (BERGQUIST SP**0S AC)thermally conductive insulation material is designed for a wide variety of applications requiring high thermal performance and electrical isolation.Â
ÂThese applications also typically have low mounting pressures for component™clamping.BERGQUIST SIL PAD **0S AC (SIL PAD TSP ***0S AC)material combines a smooth and highly compliant surface characteristic withÂ
Âhigh thermalconductivity. These features optimize the thermal resistance properties at low pressures.Applications requiring low component clamping forces include discrete semiconductors (TO***0, TO***7 and TO***8) mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount of force to the semiconductor. The smooth surface texture of SIL PAD **0S minimizes interfacial thermal resistance and maximizes thermal performance.
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ÂBERGQUIST SP**0S AC Typical Applications Include:
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
ÂConfigurations Available:
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
| Pays: | China |
| N ° de modèle: | SP900S |
| Prix FOB: | 1 ~ 2 / Piece Obtenir le dernier prix |
| Localité: | USA |
| Prix de commande minimale: | 1 per Piece |
| Commande minimale: | 10 Piece |
| Packaging Detail: | BOX |
| Heure de livraison: | 3 DAYS |
| Capacité de Fournir: | 1000 Piece per Week |
| Payment Type: | T/T |
| Groupe de produits : | SIL PAD SERIES |
