Description
Product: Tin Wire
Product composition: Sn*2% Bi*8%
Product diameter: 0.8~2.0mm
Product weight: **0g
Working temperature: **0 ℃
Melting point: **8℃
Product packaging: *0 rolls/box
Product use: suitable for low temperature lead-free packaging of
heat-resistant components, manual soldering iron welding and
automatic welding in the field of secondary packaging of circuit
boards; suitable for welding of heat-resistant components.
product description:
The melting point of Sn*2Bi*8 tin wire alloy produced
is **8℃, which can meet the welding and packaging requirements of
electronic components that are sensitive to welding temperature.
Using its own patented technology, customizing special equipment
and molds to manufacture brittle tin-bismuth alloy tin wires, the
low-temperature solder has a low melting point and the welding
operating temperature is **0 °C. Lead-free low-temperature solder
joint brightness, welding mechanical strength, tensile toughness
and electronic conductivity have been greatly improved. . It has
the characteristics of fast soldering speed and firm soldering, as
well as its fine alloy structure, uniform composition, and
excellent welding performance.
