Copper Molybdenum Copper Encapsulation Materials, electronic packing materials By Zhuzhou Jiabang Refractory Metal Co., Ltd., China
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Copper Molybdenum Copper Encapsulation Materials, electronic packing materials

Copper Molybdenum Copper Encapsulation Materials, electronic packing materials

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Zhuzhou Jiabang Refractory Metal Co., Ltd.

Zhuzhou Jiabang Refractory Metal Co., Ltd.

China

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Personne à contacter Ms. Erin

No.8 Shayuan Road, Xiangtan, Hunan

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Description

Copper molybdenum copper encapsulation materials,electronic packing materials                                                                                                                            Product Description:
It is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But Mo-Cu is much lighter than W-Cu, so that it is more suitable for aeronautic and astronautic applications.

​Features:
High thermal conductivity due to no sintering additives were used
Excellent hermeticity
Relatively small density
Stampable sheets available (Mo content not more than *5wt.%)
Semi-finished or finished (Ni/Au plated) parts available

Product information:
Type     Composition                                                Properties
  element Content wt%                                Density CTE ppm/K
TC,
W/m·K
Mass density, g/cm3
 Relative density, %T.D
Mo*0Cu*0
Mo
Cu
*0±1
balance
 9.7 ≥*9 7.6~8.5 **0~**0
Mo*0Cu*0
Mo
Cu
*0±1
balance
 9.6 ≥*9 9.2~9.4 **0~**0
Mo*0Cu*0
Mo
Cu
*0±1
balance
 9.5 ≥*9 *0.2~*0.5 **0~**0

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