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provide clear epoxy resin AB glue for rings and ornaments

FOB Price

Obtenir le dernier prix

7.5 ~ 10 / Kilogram

Minimum Order

Localit�:

Prix de commande minimale:

Commande minimale:

20 Kilogram

Packaging Detail:

4kg/pkg

Delivery Time:

3 days

Supplying Ability:

10000 Kilogram per Month

Payment Type:

T/T, L/C, D/P, Western Union

Contacter maintenant

Shenzhen Jinhua Electronic Materials Co., Ltd.

China

Membre gratuit

Personne Ã contacter Ms. Kerry

Yufeng industrial park,Jiangshi road, Gongming town,Guangming new district, Shenzhen, Guangdong

Contacter maintenant

Description

Feature
Soft Epoxy resin **7AB*5 can be cured under normal temperature or high tempeture, with low viscosity, natural defoaming, anti-UV, high transprancy, bright in surface.

Application
**7AB*5 can be widely used for stickers, labels signs, cards, crafts, lighting, lamp potting and mould filling, etc..
eightsml*P 0H ze:*0.***0pt; mso-font-kerning:1.***0pt; " > 3 to 5 minutes, and then it can be used.
2.Take the glue according to the usable time and dosage of mixture to avoid wasting. When the temperature is below *5 â„ƒ, please heat A glue to *0 â„ƒ first and then mix it to the B glue (A glue will be thicken in low temperature ); The glue must be sealed lid after use to avoid rejection caused by moisture absorption.
3.When the relative humidity is higher than *5%, the surface of the cured mixture will absorb moisture in the air, and form a layer of white mist in the surface, so when the relative humidity is higher than *5%, is not suitable for room temperature curing, suggest to use the heat curing.
Operation
1.Weigh A and B glue according to the given weight ratio into the prepared cleaned container, fully mixed the mixture again the container wall by clockwise, place it along for 3 to 5 minutes, and then it can be used.
2.Take the glue according to the usable time and dosage of mixture to avoid wasting. When the temperature is below *5 â„ƒ, please heat A glue to *0 â„ƒ first and then mix it to the B glue (A glue will be thicken in low temperature ); The glue must be sealed lid after use to avoid rejection caused by moisture absorption.
3.When the relative humidity is higher than *5%, the surface of the cured mixture will absorb moisture in the air, and form a layer of white mist in the surface, so when the relative humidity is higher than *5%, is not suitable for room temperature curing, suggest to use the heat curing.

provide clear epoxy resin AB glue for rings and ornaments

Shenzhen Jinhua Electronic Materials Co., Ltd.

Description

Send a direct inquiry to this supplier

To:

Je veux savoir:

provide clear epoxy resin AB glue for rings and ornaments

Shenzhen Jinhua Electronic Materials Co., Ltd.

Description

Send a direct inquiry to this supplier

To:

Je veux savoir:

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