Plate Type Silicon Wafer Cleaning Machine By Suzhou CSE Semiconductor Equipment Techn, China
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Plate Type Silicon Wafer Cleaning Machine

Plate Type Silicon Wafer Cleaning Machine

FOB Price

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Minimum Order

Localité:

-

Prix de commande minimale:

-

Commande minimale:

1 Set

Packaging Detail:

standard export package

Delivery Time:

20 days

Supplying Ability:

1000 Set per Year

Payment Type:

T/T, L/C

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Suzhou CSE Semiconductor Equipment Techn

Suzhou CSE Semiconductor Equipment Techn

China

Membre gratuit

Personne à contacter Ms. Lily

NO.90, Taoxin RD, Rugao City, Nantong, Jiangsu

Contacter maintenant

Description

the cleaning object is 2 to 8 inches of grinding silicon wafer. The whole equipment controlled by imported PLC. Through setting the work rhythm, transmission rack after each process, starting from material to material are done automatically. Equipment work rhythm, the parameters set by the touch screen to complete. The whole equipment is sealed structure, with air exhaust device. Unique manipulator design  to capture more accurate .Humanization design, can be customized according to user requirements

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Ms. Lily < Suzhou CSE Semiconductor Equipment Techn >

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