Description
Sputter Coating Application: Sputter coating thin film primary
be used field include decorate thin film, construction glass,
automobile widow, low radiation glass, plane display, optical
communication/ optics field, light date store field, thin film
solar cell, magnetism date store field.
Backing Plates and Bonding Service: Backing plates include
OFHC copper, Aluminum, Titanium, Stainless steel or Molybdenum. The
dimension will base on your drawing and you design.
Bonding Service
Aã€Back metallisation up to ***0 x ***0mm
Bã€Metallic and non-metallic bond coverage >*8%
Cã€Ultrasonic c-scan on bond integrity
Sputtering Targets Shape and Size: Discs, Rectangle, Step,
Plates, Sheets, Tube, Foils, Rods, Taper, Ring, S-Guns,
Custom-Made.
Disk targets, column targets, step wafer targets (Dia<**0mm,
Thickness >1mm )
Rectangle Targets, Slice Targets, Step Rectangle Targets (Longth
<***0mm, Witdh<**0mm, Thickness>1mm)
Tube Target / Rotation sputtering Target (Outer Dia < **0mm,
Thickness > 2mm)
Sputtering Targets Materials list:
Aã€Metal Sputtering Targets: Aluminum (Al),Antimony (Sb), Bismuth
(Bi), Boron (B), Cadmium (Cd), Cerium (Ce), Chromium (Cr), Cobalt
(Co), Copper ( Cu), Dysprosium (Dy), Erbium (Er), Europium (Eu),
Gadolinium (Gd), Germanium (Ge), Gold (Au), Graphite, Carbon, (C),
Hafnium (Hf), Holmium (Ho), Iridium (Ir), Indium (In), Iron (Fe),
lanthanum (La), Lead (Pb), Lutetium (Lu), Manganee (Mn), Molybdenum
(Mo), Magnesium (Mg),Neodymium (Nd), Niobiums (Nb), Nickel (Ni),
Palladium (Pd),Platinum (Pt), Praseodymium (Pr),Rhenium (Re),
Ruthenium (Ru), Samarium (Sm), Scandium (Sc),Selenium (Se), Silicon
(Si), Silver (Ag), Tantalum (Ta), Terbium (Tb), Tellurium (Te),Tin
(Sn), Thulium (Tm), Titanium (Ti), Tungsten (W), Vanadium (V),
Ytterbium (Yb), Yttrium (Y), Zirconium (Zr), Zinc (Zn)
Bã€Alloy Sputtering Targets:AlCu,
AlCr,AlMg,AlSi,AlSiCu,AlAg,AlV,CaNiCrFe, CaNiCrFeMoMn, CeGd, CeSm,
CrSi, CoCr,CoCrMo, CoFe, CoFeB ,CoNi, CoNiCr, CoPt,CoNbZr,CoTaZr,
CoZr,CrV,CrB, CrSi, CrCu, CuCo, CuGa, CuIn, CuNi, CoNiPt,
CuZr,DyFe, DyFeCo, FeB,FeC, FeMn, GdFe, GdFeCo, HfFe, IrMn, IrRe,
InSn, MoSi, NiAl, NiCr, NiCrSi, NdDyFeCo, NiFe, NiMn,
NiNbTi,NiTi,NiV,SmCo,AgCu, AgSn,TaAl,TbDyFe,TbFe,TbFeCo, TbGdFeCo,
TiAl, TiNi, TiCr,WRe,WTi,WCu,
ZrAl,ZrCu,ZrFe,ZrNb,ZrNi,ZrTi,ZrY,ZnAl,ZnMg
Cã€Ceramic Sputtering Targets
1ã€Boride Ceramic Sputtering Targets: Cr2B, CrB, CrB2, Cr5B3, FeB,
HfB2 ,LaB6, Mo2B, Mo2B5 ,NbB, NbB2, TaB, TaB2, TiB2, W2B, WB, VB,
VB2, ZrB2
2ã€Carbide Ceramic Sputtering Targets :
B4C,Cr3C2,HfC,Mo2C,NbC,SiC,TaC, TiC, WC, W2C, VC, ZrC
3ã€Fluoride Ceramic Sputtering Targets : AlF3, BaF3, CdF2, CaF2,
CeF3, DyF3, ErF3, HfF4, KF, LaF3, PbF2, LiF, PrF3, MgF2, NdF3,
ReF3, SmF3, NaF, Cryolite, Na3AlF6 , SrF2, ThF4, YF3, YbF3
4ã€Nitrides Ceramic Sputtering Targets :AlN, BN,GaN, HfN, NbN,
Si3N4, TaN, TiN, VN, ZrN
5ã€Oxide Ceramic Sputtering targets: Al2O3, Sb2O3, ATO ,BaTiO3,
Bi2O3, CeO2, CuO, Cr2O3 ,Dy2O3 ,Er2O3, Eu2O3, Gd2O3, Ga2O3, GeO2,
HfO2, Ho2O3, In2O3, ITO, Fe2O3, Fe3O4, La2O3, PbTiO3, PbZrO3,
LiNbO3, Lu3Fe5O*2, Lu2O3, MgO, MoO3, Nd2O3, Pr6O*1, Pr(TiO2)2,
Pr2O3, Sm2O3, Sc2O3, SiO2, SiO, SrTiO3, SrZrO3, Ta2O5, Tb4O7, TeO2,
ThO2, Tm2O3, TiO2, TiO, Ti3O5, Ti2O3, SnO2, SnO, WO3, V2O5, YAG,
Y3Al5O*2, Yb2O3, Y2O3, ZnO, ZnO:Al, ZrO2(unstabilized),
ZrO*****5wt%CaO)
6ã€Selenides Ceramic Sputtering Targets: Bi2Se3, CdSe, In2Se3,
PbSe, MoSe2, NbSe2, TaSe2, WSe2, ZnSe
7ã€Silicides Ceramic Sputtering Targets: Cr3Si, CrSi2, CoSi2,
HfSi2, MoSi2, NbSi2, TaSi2, Ta5Si3, TiSi2, Ti5Si3, WSi2, V3Si,
VSi2, ZrSi2
8ã€Sulfides Ceramic Sputtering Targets: CuS, Sb2S3, As2S3, CdS,
FeS, PbS, MoS2, NbS1.*5, TaS2, WS2, ZnS
Dã€Other: AZO,Cr-SiO,CIGS,ITO,IGZO, GaAs, Ga-P, In-Sb, InAs, InP,
InSn, LSMO, Na3AlF6 ,YBCO, LCMO,YSZ
