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9, **-dihydro**-oxa***-phosphahenanthrene***-oxide(DOPO)Abbreviation: DOPO CAS NO: *********5 Chemical Formula: C*2H9O2P Specification: Item Index Appearance White crystal or powder purity â?¥*9 % content â?¥*4.0% Melting point â?¥**4â?? packing *5kg/bag Application: DOPO contains a rigid phosphorus group and thus provide better thermal and flame-retardant properties than the conventional epoxy resins prepared from tetrabromobisphenol A. The advanced epoxy resins are suitable for making a fiber-reinforced epoxy resin composite which is useful in the fabrication of printed circuit boards. The cured epoxy resins can be used in semiconductor encapsulation applications.
