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China
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5ton
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Personne àcontacter Ms. Wendy
Wanjie, Zibo, Shandong
Aluminum nitride (AlN) Characteristics: Aluminum nitride has a hexagonal crystal structure and is a covalent bonded material., and is a kind of white or gray powder of loose. Aluminum Nitride (AlN) is a ceramic material possessing outstanding properties such as high thermal conductivity, low electrical resistivity, Low thermal expansion coefficient close to that of Silicon, Non-reactive with normal semiconductor process chemicals and gases and high hardness. The material is stable to very high temperatures in inert atmospheres. Application: High thermally conductive ceramics, translucent ceramics, Si-Al-O-N compounds, high temperature materials, additives, heat sinks, power and multichip modules, refractories, ceramic armor, break rings, coatings, insulators, heat radiation plates, optoelectronic devices, metal matrix composites, thermally conductive filler, IC packages and substrates, Molten metal handling components, Semiconductor processing chamber fixtures and insulators, Power transistor bases. Nano-ALN Ceramic Powders Characteristics: Nano-AlN has high purity, small and uniform particle size, large specific surface area, high surface activity, low loose vices. The sinter temperature is decreased and the device size stability is improved by using this powder in making the part of an apparatus. These devices have high hardness, high modulus, very high dielectric properties, good oxidation-resistant property and low-thermal expansion efficient, which is approximate to that of Silicon, When the ALN powers is used to make composites its interface compatibleness is good, It can improve mechanical properties, thermal conductance and dielectric properties of composites. Application: Nano-AlN can be applied to make the integrate circuit subtract, electronic devices, optical devices, thermal emission devices, crucibles used at high temperatures, preparation of composites of metal matrixes and polymer matrixes, specially, in the high temperature seal binders and electronic encapsulation materials, Nano-ALN will be substantially applied in future.
