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3-203, Shidai Jingyuan, fuyong,baoan,Shenzhen,Guangdong,China China
1). 6 oz (**0m) copper weight. 2). **9.*9***0.*5mm/1 3). CCL: FR*4 4). 2 Layer, 0.**3mm thick 5). Stack-up
1). **7 x *5mm (2UP), FR*4 Tg **0 2). 1.6mm +/**0%, 6 layer 3). Min. hole 0.*5mm, 4/4 track/gap 4). Finishe
1). *5**5mm/1, 2 layer aluminum core. 2). Conductivity of dielectric 0.8W/mk*1.0W/mk. 3). 1 oz each layer, 1
1). **0mm x *8mm/1up, FR*4, 2). 1mm +/*0.1mm, 6 Layers 3). 1oz copper finished 3). Green solder mask/white
1). FR*4 Tg**5 2). 8 x ***0mm strips 3). Double sided, 1oz, 0.8mm thick 4). Green solder mask, White overl
1) RO***0B *0mil substrate 2) *5***0mm=1PCS, 1/1 oz copper thickness 3) Double sided, large area gold plate
1). *4 different PCB&#*9;s in one Panel within **0 x **0mm 2). Same material and Thickness. 2). FR*4 Materia
1). *0 ***0mm/2up, FR*4 2). 6 layers at 1.4mm thick 3). *5 m copper weight 4). Green solder mask LPI/White
1) **0***0mm=1PCS, FR*4, Tg **5, CTI ******5V 2) Dielectric constant(Er): 4.**5.2 3) 2 layers, 1.6mm thick,
1) **0***0mm, S***0 FR*4 CTI **0V, 2) 8 layer 3) Finished inner/outer: *5 m 4) LPI Green mask/white s
1). *0**0mm/1up, 5mm thick 2). FR*4 material, *5 m copper 3). Green solder mask /white silk screen. 4). Thr
1) L1 and L4, track /space(mil) 5.1/6, precision +/**0% *0 ohm differential impedance L1, L2 and L4, t
1). PCB prototypes to small volume. 2). FR*4, 0.**5mm thick, ***0 oz 3). ***2 Lalyer 4). LPI Green solder
1). *0**0mm/1up, ITEQ IT**0A, FR*4 Tg**0 2). *0 layer, 1.6mm thick 3). *5 m copper finished 4). LPI Green s
1). 1+C*1 HDI, buried/blind L*-L5/L*-L8 vias. 2). FR*4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4).
1). Size: *5***0mm/1 up 2). Layer count: 2 Layer, *0 m PTH 3). Thickness: 1.6mm +/- *0% 4). Copper weight(
1). *8**2mm/1up, FR*4 Material 2). 8 layer, 1.0mm thick, *5 m (1 oz) 3). LPI Green solder mask/White silk sc
Personne àcontacter Mr. Kevin Liao
Nom de la société 3-203, Shidai Jingyuan, fuyong,baoan, Shenzhen, Guangdong
We will contact you soon .
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