BICHENG ENTERPRISE LIMITED

1). 6 oz (210μm) copper weight. 2). 139.99*110.85mm/1 3). CCL: FR-4 4). 2 Layer, 0.413mm thic

1). 177 x 75mm (2UP), FR-4 Tg 170 2). 1.6mm +/-10%, 6 layer 3). Min. hole 0.15mm, 4/4 track/gap 4). Finishe

1). 85*85mm/1, 2 layer aluminum core. 2). Conductivity of dielectric 0.8W/mk-1.0W/mk. 3). 1 oz each layer, 1

1). 100mm x 98mm/1up, FR-4, 2). 1mm +/-0.1mm, 6 Layers 3). 1oz copper finished 3). Green solder mask/white

1). FR-4 Tg135? 2). 8 x 1150mm strips 3). Double sided, 1oz, 0.8mm thick 4). Green solder mask, White overl

1) RO4350B 30mil substrate 2) 65*100mm=1PCS, 1/1 oz copper thickness 3) Double sided, large area gold plate

1). 14 different PCB's in one Panel within 400 x 500mm 2). Same material and Thickness. 2). FR-4 Materi

1). 80 *190mm/2up, FR-4 2). 6 layers at 1.4mm thick 3). 35 μm copper weight 4). Green solder

1) 120*130mm=1PCS, FR-4, Tg 135, CTI 175-225V 2) Dielectric constant(Er): 4.4-5.2 3) 2 layers, 1.6mm thick,

1) 160*160mm, S1600 FR-4 CTI ≥ 600V, 2) 8 layer 3) Finished inner/outer: 35 μm

1). 20*50mm/1up, 5mm thick 2). FR-4 material, 35 μm copper 3). Green solder mask /white silk s

1) L1 and L4, track /space(mil) 5.1/6, precision +/-10% 90 ohm differential impedance L1, L2 and L4, t

1). PCB prototypes to small volume. 2). FR-4, 0.3-5mm thick, 1-10 oz 3). 1-32 Lalyer 4). LPI Green solder

1). 90*90mm/1up, ITEQ IT180A, FR-4 Tg170 2). 10 layer, 1.6mm thick 3). 35 μm copper finished

1). 1+C+1 HDI, buried/blind L1-L5/L5-L8 vias. 2). FR-4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4).

1). Size: 45*140mm/1 up 2). Layer count: 2 Layer, 20 μm PTH 3). Thickness: 1.6mm +/- 10% 4).

1). 98*32mm/1up, FR-4 Material 2). 8 layer, 1.0mm thick, 35 μm (1 oz) 3). LPI Green solder mas