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Nanshan,Shenzhen,Guangdong,China China
Personne àcontacter Ms. Angela You
Nom de la société Nanshan, Shenzhen, Guangdong
Technical description: layer:14 material FR4 tg170 Board thickness: 5.0mm Surface finish immersion gold Min through hole 0.3mm(1
Technical description: layer:12 material FR4 Board thickness: 1.6mm Surface finish flash gold Min through hole 0.1mm(4mil) Min li
Technical description: layer:6 material FR4 Board thickness: 1.0mm Surface finish immersion gold Min through hole 0.1mm(4mil) Min
Technical description: minimum space size: 0.5mm ROHS complaint No. of IC: 47 pcs Soldering components: 1080pcs Minimum component size:0201
Technical description: layer:1 material PI Board thickness: 0.13mm Surface finish HAL Min through hole 0.6mm Min line width
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