Features: Resistant to UV-radiation High electrical insulation and Superior mechanical property nbsp...
    Polyimide Coverlay Film Yellow/Black Halogen free polyimide coverlay film is a kind of high temperature thermosetting epoxy resin coated with polyimide film.the insulating coating is ...
    Polyimide Film Stiffener Brown/Black Halogen free Polyimide film stiffener is made of high heat resistant and high adhesive adhesive coating on PI film substrate, and the thickness is from ...
    FEP Polyimide Film FH The FEP Polyimide is a dry adhesive tape, which is made by a polyimide film coated with Teflon FEP fluoropolymer adhesive on one side FH or both sides FHF upon high temp...
    Standard of Performance Thickness *5um Tensile strength TD **0Mpa Tensile strength MD **5Mpa Elongation *0 Young s Modulus 3.1Gpa Dielectric Constant 3.5 0.4 Diss...
    Standard of Performance Thickness *5um Tensile strength TD **0Mpa Tensile strength MD **5Mpa Elongation *0 Young s Modulus 3.1Gpa Dielectric Constant 3.5 0.4 Diss...
    Standard of Performance Thickness *5um Tensile strength TD **0Mpa Tensile strength MD **5Mpa Elongation *0 Young s Modulus 3.1Gpa Dielectric Constant 3.5 0.4 Diss...
    Standard of Performance Thickness *2.5um Tensile strength TD **0Mpa Tensile strength MD **5Mpa Elongation *0 Young s Modulus 3.1Gpa Dielectric Constant 3.5 0.4 Di...
    Standard of Performance Thickness *2.5um Tensile strength TD **0Mpa Tensile strength MD **5Mpa Elongation *0 Young s Modulus 3.1Gpa Dielectric Constant 3.5 0.4 Di...
    Standard of Performance Thickness *0um Tensile strength TD **0Mpa Tensile strength MD **5Mpa Elongation *0 Young s Modulus 3.1Gpa Dielectric Constant 3.5 0.4 Diss...
    Standard of Performance Thickness *0um Tensile strength TD **0Mpa Tensile strength MD **5Mpa Elongation *0 Young s Modulus 3.1Gpa Dielectric Constant 3.5 0.4 Diss...
    Standard of Performance Thickness *0um Tensile strength TD **0Mpa Tensile strength MD **5Mpa Elongation *0 Young s Modulus 3.1Gpa Dielectric Constant 3.5 0.4 Diss...
    Standard of Performance Thickness *5um Tensile strength TD **0Mpa Tensile strength MD **5Mpa Elongation *0 Young s Modulus 3.1Gpa Dielectric Constant 3.5 0.4 Diss...
    Standard of Performance Thickness *5um Tensile strength TD **0Mpa Tensile strength MD **5Mpa Elongation *0 Young s Modulus 3.1Gpa Dielectric Constant 3.5 0.4 Diss...
    BERGQUIST SIL PAD TSP Q***0 is a composite of aluminum foil-coated on both sides with thermally and electrically conductive SIL PAD rubber. The material is designed for those applications in which ...
    Description: Silicone resin coated fiberglass sleeving is braided with non-alkali fiberglass yarn and then coated with a special kind of silicone resin. It possesses good properties of dielectric, ...

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    Polyimide Coverlay Film Yellow/Black Halogen free polyimide coverlay film is a kind of high temperature thermosetting epoxy resin coated with polyimide film. the insulating coating is made of r...
    BERGQUIST POLY-PAD K**0 TYPICAL APPLICATIONS Power supplies Motor controls Power semiconductors BERGQUIST SIL PAD TSP PPK***0 is a composite of film coate...
    We re Chinese Manufacturer of electrical material, our products are as follows, 1. Fiberglass Sleeving Coated With Polyurethane ***1 , 2.Silicone Rubber Coated Fiberglass Sleeves 2...

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    We re Chinese Manufacturer of electrical material, our products are as follows, 1. Fiberglass Sleeving Coated With Polyurethane ***1 , 2.Silicone Rubber Coated Fiberglass Sleeves 2...

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    We re Chinese Manufacturer of electrical material, our products are as follows, 1. Fiberglass Sleeving Coated With Polyurethane ***1 , 2.Silicone Rubber Coated Fiberglass Sleeves 2...

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    Aluminized Polyimide Film Formed by sputtering metal aluminum, then develops thin aluminum layer, with one side insulation, the other side high conduct electricity. It not only has the performance ...
    BERGQUIST GAP FILLER TGF ***0 is a two-part, high performance, thermally conductive, liquid gap-filling material, which features exceptional slump resistance and high shear thinning character...
    BERGQUIST BP**8 BOND-PLY **0 BOND-PLY TBP **0 BERGQUIST BOND-PLY **0 Configurations Available: Sheet form, roll form and die-cut parts Shelf Life: The double-sided, press...
    BERGQUIST Q-Pad 3 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths. SIL PAD TSP Q***0 may be installed prior to soldering an...
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