Prix FOB
Obtenir le dernier prix( Negotiable )
|1 Set Minimum Order
Pays:
China
N ° de modèle:
-
Prix FOB:
( Negotiable ) Obtenir le dernier prix
Localité:
-
Prix de commande minimale:
-
Commande minimale:
1 Set
Packaging Detail:
-
Heure de livraison:
Ocean Shippihg
Capacité de Fournir:
2000 Set per Year
Payment Type:
T/T
Groupe de produits :
Personne àcontacter Mr. Hua
No.8 of WuLian KeYan 1th road, WuLian Village, FengGang Town, Dongguan, Guangdong
The
device is mainly applied for the pre-heating processing for
thermo-set resin material such as
melamine,epoxy
molding compound,
bakelite and urea formaldehyde molding powder, etc., including
preformed project such as compressed molding, transfer molding and
extrusion molding, etc.
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The
H.F. Preheating process is widely applied for Thermo-set plastic
molding such as for electric components, mechanical parts, bakelite
products, urea formaldehyde plastics products, melamine tablewares,
and packaging of IC, commutator, transistors and other
micro-electronic components.
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The
device can be used to improve the surface glossiness of products,
prevent water-like wrinkle and strengthen the fluidness of powder
resin. It can pre-heat and soften the powder resin (caking) prior
to the plastic packaging for the electronic components and
semi-conductor IC, so as to improve the grade and performance for
the products.
| Pays: | China |
| N ° de modèle: | - |
| Prix FOB: | ( Negotiable ) Obtenir le dernier prix |
| Localité: | - |
| Prix de commande minimale: | - |
| Commande minimale: | 1 Set |
| Packaging Detail: | - |
| Heure de livraison: | Ocean Shippihg |
| Capacité de Fournir: | 2000 Set per Year |
| Payment Type: | T/T |
| Groupe de produits : | preheater |
