Prix FOB
Obtenir le dernier prix19.95 ~ 19.99 USD / Piece
|1 Piece Minimum Order
Pays:
China
N ° de modèle:
FX533N
Prix FOB:
19.95 ~ 19.99 USD / Piece Obtenir le dernier prix
Localité:
China
Prix de commande minimale:
19.95 per Piece
Commande minimale:
1 Piece
Packaging Detail:
carton
Heure de livraison:
5days
Capacité de Fournir:
100000000 Piece per Day
Payment Type:
T/T, L/C, D/A, D/P, Western Union, Money Gram, PayPal
Groupe de produits :
Personne àcontacter phonefixNicole
undefined, undefined
QianLi ToolPlus iP**1 iP**2 Middle layer frame BGA reballing
stencil platform for Phone X XS XS MAX 1 Pro MAX motherboard
repair, ToolPlus iP**1 iP**2 Phone middle layer planting tin
soldering fixture, Qianli 3D BGA reballing metal stencil
motherboard middle frame planting tin reballing platform for Phone
logic board repair net fixture
Features :Â
Durable, unique design
Seiko, featured material
Precise positioning
Efficiency Improvement
Strong magnetic attraction
Stencils won't deform under high temperature
High quality Phone Middle Frame Reballing Platform
BGA Reballing Platform for Phone X/XS/XS MAX/*1/*1 Pro/*1 Pro
MAX.
Make your repair work easier
| Pays: | China |
| N ° de modèle: | FX533N |
| Prix FOB: | 19.95 ~ 19.99 / Piece Obtenir le dernier prix |
| Localité: | China |
| Prix de commande minimale: | 19.95 per Piece |
| Commande minimale: | 1 Piece |
| Packaging Detail: | carton |
| Heure de livraison: | 5days |
| Capacité de Fournir: | 100000000 Piece per Day |
| Payment Type: | T/T, L/C, D/A, D/P, Western Union, Money Gram, PayPal |
| Groupe de produits : | soldering tools |
