Qianli 4 IN 1 middle frame reballing platform By Shenzhen weikexiu technology Co., Ltd,
Pas encore membre de TradeKey.com? Inscrivez-vous pour vous connecter avec 9 millions d'importateurs et exportateurs.
Rejoignez-le maintenant c'est gratuit |
BOOK A CALL
Book Call On Your Favorite Time

By Signing Up. I agree to TradeKey.com Terms of Use, Privacy Policy, IPR and receive emails related to our services

Contact Us
product
Prev
Qianli 4 IN 1 middle frame reballing platform
Next

Qianli 4 IN 1 middle frame reballing platform

23.95 ~ 23.99 / Piece

|

1 Piece Minimum Order

Pays:

China

N ° de modèle:

FIX533-13

Prix FOB:

23.95 ~ 23.99 / Piece Obtenir le dernier prix

Localité:

China

Prix de commande minimale:

23.95 per Piece

Commande minimale:

1 Piece

Packaging Detail:

carton

Heure de livraison:

5days

Capacité de Fournir:

100000000 Piece per Day

Payment Type:

T/T, L/C, D/A, D/P, Western Union, Money Gram, PayPal

Groupe de produits :

Contacter maintenant
Membre gratuit

Personne à contacter phonefixNicole

undefined, undefined

Contacter maintenant

Spécification du produit

  • color:black

La description

Qianli 4 IN 1 middle frame reballing platform for Phone *3/*3 Pro/*3 Pro Max/*3 mini. Qianli Magnetic middle frame reballing platform 4 in 1 for Phone *3 series. Qianli Phone *3 series 4 in 1 double-sided middle layer reballing stencil platform regular/simple version for Phone *3 motherboard soldering repair. Qianli 4 in 1 motherboard tin planting platform for Phone ****3 Pro Max. 

Features:
Multiple Models: Suitable for Phone *3/*3Pro /*3Pro Max /*3Mini, innovative single-sided. 4 models universal to meet your maintenance needs.
Silicone non-slip foot pads, specific weighted iron plate at the bottom Silicone anti-slip foot pads are used at the bottom to effectively isolate the temperature, anti-skid and anti-scald, so that the tin planting position is more stable.
Stencils with no bulge under high temperature: 4 in 1 Middle frame reballing platform Precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge Phone *3/*3Pro /*3Pro Max /*3Mini.

User's Guide Shows:
Step 1: Install the motherboard. Put the lower layer of motherboard that needs reballing to the corresponding positioning pins. Place it in the synthetic stone base.
Step 2: Install stencils
Align the stencils of the corresponding model with the positioning pins and put it into the base.
Step 3: Apply solder paste Apply the solder paste at the corresponding temperature to the reballing hole, make sure that each hole is covered with solder paste.
Step 4: Heat evenly Combine the top cover of the product with the base and operate. Use the hot air gun to heat the corresponding reballing hole.

Pays: China
N ° de modèle: FIX533-13
Prix FOB: 23.95 ~ 23.99 / Piece Obtenir le dernier prix
Localité: China
Prix de commande minimale: 23.95 per Piece
Commande minimale: 1 Piece
Packaging Detail: carton
Heure de livraison: 5days
Capacité de Fournir: 100000000 Piece per Day
Payment Type: T/T, L/C, D/A, D/P, Western Union, Money Gram, PayPal
Groupe de produits : soldering tools

Send a direct inquiry to this supplier

To:

phonefixNicole < Shenzhen weikexiu technology Co., Ltd >

Je veux savoir: