Â
1. An LVDS
The LVDS output interface USES very low voltage fluctuation
(about **0mV) to transmit data through the differential data
of two PCB lines or a pair of balanced cables. Low voltage
differential signal transmission. Put forward a kind of an
LVDS output interface, this interface can make the difference
balance PCB line or cable transmission signal transmitted at
the speed of several hundred megabit per second, therefore,
low voltage and low current drive mode to achieve the low
noise and low power consumption. At present, the LVDS output
interface is widely used in the LCD screen of *7in and above.
Its benefits and functions are as follows:
(1) high-speed transmission capacity
(2) low noise/low electromagnetic interference
(3) low power consumption
(4) low voltage
2. The HOTBAR
Hot hot molten solder, will need to connect the two
electronic components connected, flat solder (usually FPC or
FFC) with a long belt thermal head welding on the circuit
boards or connector, so it is called the HotBar. It is
different from the thermal sealing process of ACF on the LCD
or circuit board. The hot rod is usually used to weld the
soft board (FPC/FFC) onto the PCB or connector to make it
light, thin, short, small, and effectively reduce the
production cost.
3. Gold-plating process
Gold element has a low contact resistance, good conductivity,
easy to welding, corrosion resistance is strong, and has a
certain wear resistance (refers to solid gold), therefore,
electric plating in precision instruments, printed circuit
board, integrated circuit, FFC contact, electrical equipment,
electric contact is widely used in such aspects.
Due to welding solder formation of intermetallic compounds
are Ni (Sn - Ni compound), and Au plating layer is used to
protect the Ni layer, therefore, FFC contact before plating
need as electroplating with nickel material base (other such
as zinc, lead and zinc alloy surface treatment are also made
at the bottom of the Ni to material). In addition, the nickel
plating layer is mainly as a barrier layer between copper and
gold layer, can prevent spread of gold and copper with each
other, influence the weldability and service life of the
products, at the same time, nickel base layer can greatly
increase the mechanical strength of plating layer, color,
gloss and color stability.
2. Narrow slit: the laser beam focuses on a small point of
light, which causes the focal point to reach a high power
density. The material is quickly heated to the degree of
gasification, and evaporation forms the hole. With the
relative linear movement of the beam and the material, the
hole is continuously formed in a narrow slit. The cutting is
usually 0.**0.2mm.
3. Smooth cutting surface: the cutting surface has no burrs,
and the surface roughness of the incision is generally
controlled in Ral2.5; In A.
4. Speed: cutting speed can reach l0m/min, faster than line
cutting.
5. Good cutting quality: no contact cutting, the cutting edge
is very small, there is no thermal deformation of the
workpiece, completely avoid the collapse of the material in
the cutting, and the cutting is not required to be processed
twice.
6. No damage to the workpiece: the laser cutting head will
not contact the surface of the material and will not scratch
the work piece.
2. Die cutting processing
(1) high production efficiency. Maximum speed can reach **0~
**0m/MLN.
(2) good quality of die cutting. Die cutting is the way of
wire contact processing. The working pressure small product
has good forming stability and the geometrical shape is
accurate.
(3) high precision of die cutting. The die cutting machine is
equipped with a high precision set and die cutting phase
adjustment device, which can obtain quite high die cutting
precision.
