La description
F4b 2Layer High
Frequency PCB Printed Circuit Boards Fabrication
Manufacturer
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PCB information:
Material: F4Bm**5 Â Chinese high frequency material
Surface finish: OSP
Copper weight:2OZ
Color: Black
Size: 5*5 CM Circle
Thickness: 1.6MM
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Basic characteristics of high-frequency substrate materials
require:
(1) The dielectric constant (Dk) must be small and stable. Usually,
the smaller the better, the slower the transmission rate of the
signal is inversely proportional to the square root of the
dielectric constant of the material. High dielectric constant can
easily cause signal transmission delay.
(2) Dielectric loss (Df) must be small, which mainly affects the
quality of signal transmission. The smaller the dielectric loss,
the smaller the signal loss.
(3) The coefficient of thermal expansion of copper foil should be
as consistent as possible, because the inconsistency will cause
separation of copper foil in cold and hot changes.
(4) Low water absorbency and high water absorption will affect
dielectric constant and dielectric loss when exposed to
moisture.
(5) Other heat resistance, chemical resistance, impact strength,
peel strength, etc. must also be good.
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In general, high frequencies can be defined as frequencies above 1
GHz. Currently used high-frequency circuit board substrates are
fluorine-based dielectric substrates, such as
polytetrafluoroethylene (PTFE), which is usually referred to as
Teflon. Above 5GHz. There are also FR*4 or PPO substrates that can
be used between 1GHz and *0GHz. The physical properties of these
three high-frequency substrates are compared as follows.
At the present stage, the three types of high-frequency substrate
materials used are epoxy resin, PPO resin, and fluorine-based
resin. The epoxy resin is the cheapest and the fluorine-based resin
is the most expensive; the dielectric constant, dielectric loss,
and water absorption Considering the frequency characteristics, the
fluorine resin is the best and the epoxy resin is poor. When the
frequency of application of the product is higher than *0 GHz, only
the fluororesin printed board can be applied. Obviously, the
high-frequency performance of fluorine-based resin is much higher
than that of other substrates. However, its disadvantages are poor
rigidity and high coefficient of thermal expansion, in addition to
high cost. For polytetrafluoroethylene (PTFE), a large amount of
inorganic material (eg, silica SiO2) or glass cloth is used as a
reinforcing filler material to improve the rigidity of the
substrate and reduce the thermal expansion thereof for the purpose
of improving the performance. In addition, due to the molecular
inertness of the PTFE resin itself, it is not easy to combine with
the copper foil. Therefore, a special surface treatment with the
copper foil is required. Treatment methods include chemical etching
or plasma etching on the surface of Teflon to increase the surface
roughness or to increase the adhesion between the copper foil and
Teflon resin to increase the bonding force, but may have a
dielectric property. influences.
The development of the entire fluorine-based high-frequency circuit
board requires cooperation among raw material suppliers, research
institutes, equipment suppliers, PCB manufacturers, and
communication product manufacturers to keep up with the rapid
development of high-frequency circuit boards. .
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| Pays: |
China |
| N ° de modèle: |
one-1
|
| Prix FOB: |
0.01 ~ 5 / Piece (Negotiable)
Obtenir le dernier prix
|
| Localité: |
- |
| Prix de commande minimale: |
0.01 per Piece |
| Commande minimale: |
1 Piece |
| Packaging Detail: |
- |
| Heure de livraison: |
5 DAYS |
| Capacité de Fournir: |
- |
| Payment Type: |
T/T, L/C, Western Union, PayPal |
| Groupe de produits : |
- |
