La description

Specification PCB thickness: 0.5~4mm PCB dimension:W*0ׄ*0~W**0ׄ**0mm Working table adjustment: ?*0mm forward/backward, ?**0mm left/right Temperature control: K-type thermocouple, close cycle controlled Preheater( far infrared): ***0W Upper heater( hot air): **0W Lower heater( hot air): **0W Power supply: single-phase **0V, *0/*0Hz, 4.5KW Machine dimension: L**0ח**0׈**0mm Weight: Appox. *0Kgs Description * Made of high quality heating material; desoldering and soldering procedures of BGA are precisely controlled; * The movable heating head, which is able to move freely horizontally&longitudinally, is easy to be operated; * Touch screen interface, PLC control; real-time profile display, able to display set profile and practically-tested profile at the same time; * 6 segments of temperature up (down) and 6 segments constant temperature control, **0 groups of profile are stored, profile analysis can be carried out on the touch screen; * The temperatures of the upper and lower hot air guns can be precisely controlled according to their specific temperatures. The infrared constant temperature heating zone at the lower part and the appropriate temperature-control settings make the rework safer and more reliable. * The supports for the BGA soldering supporting frame are micro-adjustable to restrain local sinkage. * Powerful cross flow fans cool the lower heating area rapidly; * The adjustable PCB positioning support, onto which the special fixtures for allotype board could be installed, enables easy and fast positioning of the PCB board; * Buzz after soldering is finished or desoldering;Hand vacuum pen is adjustable for removing BGA; * Both the upper and lower parts are equipped with over-temperature alarming and protection apparatus. * With different alloy hot gas nozzles, easy to ***** could be tailored as per the specific requirements. 