Shenzhen Anst Technology Co., Ltd

ANST has whole assembly and test lines and ***0 set main machines. The assembly building is ****0 square meters and test building is ****0 square meters. ANST has world-class IC assembly process and analog, digital and mix-signal test process. After several years development, ANST has over **0 packages including DIP, SOP, SSOP, MSOP, QSOP, TSOT, QFP, QFN and Flip chip. Basing on developing traditional IC assembly and test technology, ANST focus on developing advanced assembly research and development. We developed *0um *2inch wafer backgrinding and sawing process, high density gold wire and copper wire wire bonding process, OCDIP, OCSOP, MEMS, FC-SOICFC-TSOTFC-QFN etc., and have many intellectual property.