High Viscosity 3W/MK Thermally Conductive Putty For BGA Package By Dongguan Ziitek Electronical Material and Technology Ltd, China
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High Viscosity 3W/MK Thermally Conductive Putty For BGA Package

High Viscosity 3W/MK Thermally Conductive Putty For BGA Package

( Negotiable )

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Minimum Order

Localité:

-

Prix de commande minimale:

-

Commande minimale:

1 Piece

Packaging Detail:

30 cc/pc, 98 pc/box�300 cc/pc 6 pc/box

Delivery Time:

3-7days

Supplying Ability:

10000 Piece per Week

Payment Type:

T/T

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Membre gratuit

Personne à contacter Sophia

B8 building, Dongguan, Guangdong

Contacter maintenant

Description

High Viscosity 3W/MK Thermally Conductive Putty For BGA Package

 

TIF030-05 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF100-15 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides, compared with traditionally thermal pad, it can control bonded shifiting issue much better.

 

TIF030-05 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF100-15 can be applied on chip micro processor,PPGAs,Micro BGA package,,DSP chip,LED lighting and other high power electric component.

 

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Application

> Heat-sink & frame
> LED backlight module,LED lighting
> High speed hardware driver
> Micro heat pipe ,Vihicel enginee controler
> Telecom industry

Feature
> Thermal conductivity:  3W/mK
> Soft, very low compression
> Operate automaticly

                                                      TIFTM030-05 Property
Color Blue Visual
Construction & Composition Ceramic   filled silicon material **********
Viscosity 2000,000cps GB/T 10247
Specific Gravity 2.95   g/cc ASTM D297
Thermal conductivity 3.0   W/mK ISO 22007-2
Thermal diffusivity 1.053   mm2/s ISO 22007-2
Specific heat capacity 3.2   MJ/m3K ISO 22007-2
Continuous Use Temperature -45   ~200°C ******
Dielectric breakdown strength 200   V/mil ASTM D149
Flame Rating 94V0 E331100
Outgassing,%TML 0.80% ASTM E595

 

Company Profile

 Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

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To:

Sophia < Dongguan Ziitek Electronical Material and Technology Ltd >

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