Description

â–  Main Handling Applications 
(1) Big-Size Flat Film and Panel
(2) Big-Size Warp Wafer Transfer and Moving
(3) Semiconductor BGBM Thin Wafer
(4) Thin Warp Wafer
(5) Move-Free Shape Reinforcement
(6) Cupper Foil
(7) Soft Film
(8) Curved Glass
(9) Vacuum Lamination in OLED, Touch Panel
(*0) Vacuum deposition

â–  Product Features
(1) Coulomb-Force Electrostatic Chuck.
(2) Patent Coulomb-Force E-Chuck was developed long time and has dozens of international patents.
(3) Stable and uniform adhesion force is achieved by applying the voltage to the electrode 
(4) Apply lowest voltage to keep maximum adhesion force.
(5) Because voltage potential of object backside is zero, adhesion will not affect the backside circuits.
(6) Be able to adhere various materials : metal / semiconductor / glass / paper / porous materials.
(7) Work normally in a vacuum environments and general atmospheric environments.
(8) Can define adhesion area and non-adhesion area. Non-adhesion area can define other functions.
(9) Can be made by different substrates. Such as stainless, aluminum, ceramic, semiconductor wafer or glass. 
(*0) Can be customized into various sizes and thicknesses for customer\'s applications.
(*1) Advanced technology enclose electrical field in the E-Chuck. E-Chuck become as move-free carrier.
(*2) After adhesion setting, Move-Free Supporter can move freely even disconnecting the power supply. Move-Free support can support hardness or shape reinforcements for thin wafer or glass panel.