FOB Price
Obtenir le dernier prix2 ~ 3 / Piece
|Minimum Order
Localité:
-
Prix de commande minimale:
Commande minimale:
1000 Piece
Packaging Detail:
box
Delivery Time:
5-7 days
Supplying Ability:
1000000 Piece per Day
Payment Type:
T/T
Personne àcontacter sophia
Block C, Phase 1, Smart Home, No. 76 Baohe Avenue, Baolong Street, Longgang District, Shenzhen City, Shenzhen, Guangdong
Product Model：HY**0R**4S1C
Size: *1.5*9.0*2.0mm
Modulation Mode：GFSK
Antenna Type： Ceramic antennas
Bluetooth BLE 5.0 single mode compliant
Transmission Distance：*0M（The actual distance is subject to the test environment）
Integrated Bluetooth low energy stack
GAP, GATT, L2CAP, SMP Bluetooth low energy profiles
Compliance: BQB BLE5.0, FCC, IC(Canada), CE ETSI RED…etc. worldwide RF Regulations.
Transmit power :**1dBm~*5dBm typical
Receiver sensitivity: **7dBm typical
In-System-Programmable Flash **8KB SRAM 8KB
*0 programmable GPIO
Programmable ARM Cortex-M3 processor for embedding full applications
Low current consumption :Shutdown. No clocks running, no
retention: **0nA(Typical)
Description
HY**0R**4S1C integrates all features required for a Bluetooth Low power aplication ，which is a highly integrated Bluetooth 5.0 module targeted for low power Smart Devices and loT applications. HY**0R**4SICC also provides *0 programmable GPIO for low power product applications.
HY**0R**4S1C offers all Bluetooth low energy features: radio, stack, profiles and application space for customer applications. The module also provides flexible hardware interfaces to connect sensors.
HY**0R**4S1C can be powered directly with a standard 3V coin cell batteries or pair of AAA batteries.
In lowest power shutdown mode it consumes only 0.*5uA and will wake up in few microseconds.
HY**0R**4S1C transmission distance of *0meter or more. (At face to face, free space, 1.2 Meter high from Ground for testing).
Bluetooth IC：TTC***0R2 4*4*0.9mm *2pin IC,Used TI CC***0R2 die chip
