Description
Made in Taiwan, ROC
LED heat disspation
solution
Key Features
Thin & Thick Film DPC /DBC Substrate OEM/ODM
Ceramic metallized: gold(Au),
sliver(Ag),Copper(Cu),nickel(Ni)…others & produce final
circuit
coating:0.1um to 5mil
Ceramic Metallized substrate
Al2O3 substrate metallized
AlN substrate metallized
Silicon wafer metallized
LED heat-dissipation ceramic substrate
LED Al2O3 thin film substrate
LED Al2O3 thick film substrate
LED AlN thin film heat-dissipation substrate
Flip chip substrate
The integration of the thin film,thick film,electrode plating and
electroless plating processes
Application:
1. High Power LED ceramic substrate
2. Microwave (Wireless Communication & Radar)
3. Semiconductor Process Equipment
4. Solar Cell
5. Hybrid Electric Vehicles
6.Flip chip/eutectic substrate
7.Sensor ceramic substrate
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Payment
Terms:Other ,DA ,TT ,L/C
