Ceramic PCB, ceramic substrate, ceramic metallization, AlN, Al2O3, direct plating copper, DPC, DBC, ceramic heating substrate, LED substrate By Tensky International, Taiwan
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Ceramic PCB, ceramic substrate, ceramic metallization, AlN, Al2O3, direct plating copper, DPC, DBC, ceramic heating substrate, LED substrate

Ceramic PCB, ceramic substrate, ceramic metallization, AlN, Al2O3, direct plating copper, DPC, DBC, ceramic heating substrate, LED substrate

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Prix de commande minimale:

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Commande minimale:

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Packaging Detail:

It depends on the actual design and different customized speciffications

Delivery Time:

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Supplying Ability:

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Payment Type:

Other, D/A, L/C, T/T

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Personne à contacter Mr. Reg

Jhongshan RD, Hsinchu, Hukou

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Description

Made in Taiwan, ROC
Key Features


Ceramic metallized: Ti/W,gold(Au), sliver(Ag),Copper(Cu),nickel(Ni), (AL) and others & produce final circuit

coating:0.**5um to 5mil

Ceramic Metallized substrate:

Al2O3 substrate metallized

AlN substrate metallized

Silicon wafer metallized

LED heat-dissipation ceramic substrate:

LED Al2O3 thin film substrate

LED Al2O3 thick film substrate

LED AlN thin film heat-dissipation substrate

Flip chip substrate:

The integration of the thin film,thick film,electrode plating and electroless plating processes:

 

Application:

1. High Power LED ceramic substrate

2. Microwave (Wireless Communication & Radar)

3. Semiconductor Process Equipment

4. Solar Cell

5. Hybrid Electric Vehicles

6.Flip chip/eutectic substrate

7.Sensor ceramic substrate

  • Payment Terms:D/A ,TT ,L/C

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Mr. Reg < Tensky International >

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