Ceramic substrate, Ceramic PCB, ceramic metallization, AlN, Al2O3, direct plating copper, DPC, DBC, ceramic heating substrate, ceramic based pcb By Tensky International, Taiwan
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Ceramic substrate, Ceramic PCB, ceramic metallization, AlN, Al2O3, direct plating copper, DPC, DBC, ceramic heating substrate, ceramic based pcb

Ceramic substrate, Ceramic PCB, ceramic metallization, AlN, Al2O3, direct plating copper, DPC, DBC, ceramic heating substrate, ceramic based pcb

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Minimum Order

Localité:

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Prix de commande minimale:

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Commande minimale:

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Packaging Detail:

It depends on the actual design and different customized specifications

Delivery Time:

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Supplying Ability:

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Payment Type:

Other, D/A, L/C, T/T

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Personne à contacter Mr. Reg

Jhongshan RD, Hsinchu, Hukou

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Description

Model No.: LTCC***5, LTCC***0, ***5, ***8

Made in Taiwan, ROC 

Key Features

 

Ceramic metallized: Ti/W,gold(Au), sliver(Ag),Copper(Cu),nickel(Ni)¡Kothers & produce final circuit

 

coating:0.**5um to 5mil

 

Ceramic Metallized substrate:

 

Al2O3 substrate metallized

 

AlN substrate metallized

 

Silicon wafer metallized

 

LED heat-dissipation ceramic substrate:

 

LED Al2O3 thin film substrate

 

LED Al2O3 thick film substrate

 

LED AlN thin film heat-dissipation substrate

 

Flip chip substrate:

 

The integration of the thin film,thick film,electrode plating and electroless plating processes:





Application:

 

1. High Power LED ceramic substrate

 

2. Microwave (Wireless Communication & Radar)

 

3. Semiconductor Process Equipment

 

4. Solar Cell

 

5. Hybrid Electric Vehicles

 

6.Flip chip/eutectic substrate

 

7.Sensor ceramic substrate

Send a direct inquiry to this supplier

To:

Mr. Reg < Tensky International >

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