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Taiwan
Personne àcontacter Mr. Reg
Jhongshan RD, Hsinchu, Hukou
Al2O**3x3 for 5~6W
(pnl:**6.6x*7.*5mm for *6pcs)
Size:*2x*2xt0.5mm with 0.7~0.8mm silicon cavity.
Chips size: *4mil~*5mil LED COB ceramic substrate Al2O***3x3 for 9
die and 5~6Wt used Al2O***5x5 for *5 die and *0 Wt used AlN**7x7
for *9 die and *0Wt used AlN *0x*0 for **0 die and **0Wt used
Ceramic metallized: Ti/W,gold(Au),
sliver(Ag),Copper(Cu),nickel(Ni)¡Kothers & produce final
circuit plating: 1um~**0um Ceramic Metallized substrate: Al2O3
substrate metallized AlN substrate metallized Silicon wafer
metallized LED heat-dissipation ceramic substrate: LED COB ceramic
substrate LED Al2O3 thin film substrate LED Al2O3 thick film
substrate LED AlN thin film heat-dissipation substrate Flip chip
substrate: The integration of the thin film,thick film,electrode
plating and electroless plating processes.
Application: 1. High Power LED ceramic substrate 2. Microwave
(Wireless Communication & Radar) 3. Semiconductor Process
Equipment 4. Solar Cell 5. Hybrid Electric Vehicles 6.Flip
chip/eutectic substrate 7.Sensor ceramic substrate
Payment
Terms:D/A , T/T ,
L/C
