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Taiwan
Personne àcontacter Mr. Reg
Jhongshan RD, Hsinchu, Hukou
AlN(*0X*0)-COB Ceramic substrate**-for power *****0W
AlN**0x*0 for **0W
( pnl:**4.3x**4.3mm for 9pcs)
Size:*4.*6x*4.*6xt0.5mm with Ceramic t0.5mm cavity
Plating: Cu *0um/Ni5um/pd0.**5um/Au0.1um or Cu*0um/0.5um
Chips Size: *5mil~*0mil