Description
GLPOLY The thermal gel XK-G*0 is a high performance thermal
management solution for electronics assembly, it is thermally
conductive particle filled silicone gel with high conformability
and thermally conductive properties.
XK-G*0 is formulated to accommodate todays high performance
electronics requirements and designed to transfer a high degree of
heat away from hot components to heat sink. Chomerics THERM-A-GEL
*0
It is a fully cured, no pump out, auto dispensable thermal
interface material designed to replace conventional thermal
conductive gap filler or pad. Simply dispense thermal gel onto
component, assemble heat sink over it, and the product is ready to
go. It is ideal for rework and maintainment situation.
This thermal gel does not require mixing and cure cycle,
auto-dispensing process can reduce the assembly time and cost,
which make the design more flexible. Chomerics THERM-A-GEL *0
With ultra soft properties, this thermal gel can easily deflect
under very low compression force and will fill voids and uneven
surfaces, accommodating a variety of bond line thickness. Thermal
gel XK-G*0 will also wet out matting surfaces in order to
efficiently transfer heat from components to the heat sink.
Thermal gel XK-G*0 can be stored at room temperature without any
filler settling issues and is supplied in one-part, it is
alternative toChomerics THERM-A-GEL *0.
Features
Silicone type range with 1.5/2.0/3.2
/6.0W/m.K
Have enough
compressibility
Very low thermal
resistance
Good creep performance
Best for north bridge
IC
Applications
Consumer electronics./Automotive
Systems./Telecommunications./
Hand-set applications
