Description
GLPOLY thermal pad is featuring a high thermal conductivity of
6.0W/mK, its higher than that of most of competitor. Comparing with
Bergquist gap pad ***0S*5, the data will shows that GLPOLY thermal
gap filler pad can perfectly replace the BQ ***0S*5.
Firstly, the thermal conductivity of GLPOLY thermal gap filler pad
is higher that that of BQ ***0S*5; the thermal resistance is only
0.*6℃in2/W, its just one third of BQ ***0S*5. Comparison data
reflects that GLPOLY thermal gap filler pad offers more excellent
thermal performance than BQ***0S*5.
For the electrical property, the dielectric breakdown voltage is
*6KV, its 3 times greater than BQ ***0S*5s. this will ensure the
stability of performance of devices.
The material yields extremely soft characteristics while
maintaining elasticity and conformability. Conforms to demanding
contours and maintains structural integrity with little or no
stress applied to fragile components. The inherent natural tack on
both sides assists in application and allows the products to
effectively fill gaps, reducing thermal resistance and
enhancing the overall thermal performance.
GLPOLY thermal gap filler pad is ideal for high-performance
application at low stress or pressure.
Features
Ultra conformable,gel-like
modulus
Designed for low-stress
applications
Conformable, low
hardness
Applications
Telecommunications
ComputerBetween any
heat-generating semiconductor and a heat sink
