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ceramic packages, Microwave Device Packages, GaAs , GaN microwave device package

FOB Price

Obtenir le dernier prix

1 ~ 100 / Piece ( Negotiable )

Minimum Order

Localit�:

Prix de commande minimale:

Commande minimale:

50 Piece

Packaging Detail:

carbon box

Delivery Time:

20-40 days

Supplying Ability:

10000 Piece per Week

Payment Type:

T/T, L/C

Contacter maintenant

Golden Steel Industrial Limited

China

Membre gratuit

Personne Ã contacter Ms. Kellen

Jinyuegongg ,Qiaoxi District, Shijiazhuang, Hebei

Contacter maintenant

Description

ceramic packages,Microwave Device Packages,GaAs , GaN microwave device package
The package is made of metal wall,metal base and multilayered ceramic feedthrough withthe features of excellent reliability,low translation loss and high shielding performace ,the highest frequency up to Ka band.
The packages can be used in RF power device and moudle packaging, HIC,MMIC, packaging with excellent impedance matching and low insertion loss,the power can up to **0 W,frequency up to *0GHZ. It is suitable for silicon power transistor, LDMOS devices,GaAs and GaN power deviceds packaging .

ceramic packages, Microwave Device Packages, GaAs , GaN microwave device package

Golden Steel Industrial Limited

Description

Send a direct inquiry to this supplier

To:

Je veux savoir:

ceramic packages, Microwave Device Packages, GaAs , GaN microwave device package

Golden Steel Industrial Limited

Description

Send a direct inquiry to this supplier

To:

Je veux savoir:

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