FOB Price
Obtenir le dernier prix( Negotiable )
|Minimum Order
Localit:
-
Prix de commande minimale:
-
Commande minimale:
10 Piece
Packaging Detail:
resin bond diamond cutting discs
Delivery Time:
10-15 days
Supplying Ability:
3000 Piece per Month
Payment Type:
T/T, Western Union, Money Gram, PayPal, Other
Personne à contacter Cocoa
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high precision superthin resin cutting discs
Main Features:
1. Excellent cutting capacity
2. Quality cutting of hard and fragile materials
3. Varieties of bonds, suitable for cutting all kinds of materials
Application:
Resin bond dicing blade is mainly used to cut and make groove in metal and nonmetal materials which are hard to cut and groove, such as:
1 .Semiconductor materials: Si, Ge, GaP, GaAs, GaAsP, BiSb, BGA, QFN,SiC,FQFN, solar battery and so on.
2. Ceramic materials: Al2O3, ZrO2, Si3N4, BaTiO3, CaTiO3 and so on.
3. Magnetic materials: magnetic core, magnetic sheet and so on.
4. Metal materials: high speed steel, tool steel, die steel, bearing steel and so on.
5. Other materials: glass, crystal, electronic components and so on.
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Product name: |
resin diamond cutting discs for Semiconductor materials |
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Type |
resin bond |
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Feature: |
1. Grinding efficiently, good wear resistance, |
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Usage: |
Mainly used for grinding, abrasive, sharpening. used for metal material, such as steel etc. |
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PS: |
specific sizes can be customized |
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size |
**0mm***0mm |
