Metal Bond Diamond Dicing Blades for PCB, IC, BGA By Henan Yinwang Trade Co. , Ltd, China
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Metal Bond Diamond Dicing Blades for PCB, IC, BGA

Metal Bond Diamond Dicing Blades for PCB, IC, BGA

1 ~ 100 / Piece ( Negotiable )

|

Minimum Order

Localité:

-

Prix de commande minimale:

Commande minimale:

1 Piece

Packaging Detail:

customized

Delivery Time:

3-5 days

Supplying Ability:

1000000 Piece per Week

Payment Type:

T/T, L/C, D/A, D/P, Western Union, Money Gram, PayPal

Contacter maintenant
Membre gratuit

Personne à contacter chenkai

HangHai Road, ZhengZhou , China, Zhengzhou, Henan

Contacter maintenant

Description

Features

Wear resistance between nickel and resin blade

Strong abrasive and high wear resistance, suitable for the precision materials

Average the particle size distribution, reduce inclined cutting and wave cutting effectively.

Precise control of the concentration is suitable for the application of multiple materials.

Blade with slot can effectively improve the cutting quality and blade life.

      

Application

    Electronic device, ceramic substrate, optical glass, optical device(lens, window and substrate), semiconductor packing device, SMD L ED PCB, LED ceramic substrate, etc.

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chenkai < Henan Yinwang Trade Co. , Ltd >

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