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Personne àcontacter Mr. Vito
Longgang, Shenzhen, Guangdong
DEUTEQ
CUBRITE **4
Acid Copper Strike
Introduction
1. Used in plating on plastics cycles following either electroless copper plate or properly conditioned electroless nickel plate.
2. Improve low current density coverage, increase throwing power, more uniform color and leveling from the following bright acid copper plate, and decreased tendency for "burn-off".
3.
Used on any commercially plateable plastic
substrate.
Operating Conditions
Copper Sulfate *7.5 to *0 g/L
Sulfuric Acid **2.5 to **5 g/L
Chloride Ion *0 to **0 mg/L
DEUTEQ CUBRITE **4 0.*8 to 0.*5%
Temperature *4 to *0°C
Cathode Current Density 0.8 to 1.5 ASD
Anode Current Density 1.4 to 3.0 ASD
Tank Voltage 1.0 to 3.0 Volts
