FOB Price
Obtenir le dernier prix1 ~ 50 / Piece ( Negotiable )
|Minimum Order
Localité:
China
Prix de commande minimale:
Commande minimale:
2000 Piece
Packaging Detail:
Vacuum
Delivery Time:
35 days
Supplying Ability:
30000 Piece per Month
Payment Type:
PayPal, Money Gram, Western Union, L/C, T/T
Personne àcontacter Ms. Erica
Siming District, Xiamen, Fujian
AlN has exellent thermal conductivity,is thus considered as high performance electronic package material.
Innovacera offers series substrates based on AIN materials for use in application environments.
These materials are availiable in both lapped and "as fired" condition as well as metallized and non-metalized substrates.
Features
High thermal conductivity,7 to 8 times as much as alumina
Thermal expansion is close to silicon wafer
High insulation resistivity
High density and high mechanical strength
Good chemical durability
Applications
Power modulus,IGBT,MOSFET...
High power LED package
LED chip submount
