FOB Price
Obtenir le dernier prix0.1 ~ 0.5 / Piece ( Negotiable )
|Minimum Order
Localité:
China
Prix de commande minimale:
Commande minimale:
1 Piece
Packaging Detail:
vacuum packing, carton box
Delivery Time:
6wd
Supplying Ability:
15000 Square Meter per Month
Payment Type:
T/T, Western Union
Personne àcontacter Ms. candy
Kaifeng Rd.No.4, Shenzhen, Guangdong
1, copper clad pcbprinted circuit board manufacturer
2,ShengYi FR4 material
3,immersion gold
4,green solder mask
5,white silk
6,Board thinkness 1.6mm
7.pcb
certificate:UL/SGS/Rohs/ISO***1/ISO****0
8.OEM service offered
9.competitive price
*0.timely delivery
Quotation time:
1. For PCB & FPC: quotation within 1 hours if all information are clear
2. For PCBA: quotation within 2 days if all information are clear
One-stop Service:
1. PCB Copy
2. PCB drawing / design according to your schematic diagram
3. PCB manufacturing
4. Component sourcing
5. PCB Assembly
6. PCBA test
Delivery Time:
| Layers | Sample | First Order | Repeat Order |
| Single side | 3 days | 7 days | 6 days |
| Double side | 4 days | 8 days | 7 days |
| 4 Layer | 7 days | 9 days | 8 days |
| 6 Layer | 8 days | *0 days | 9 days |
| 8 Layer | *0 days | *2 days | *0 days |
| *0 Layer | *2 days | *4 days | *2 days |
| Alu-base | 3 days | 8 days | 7 days |
| FPC 1 layer | 5 days | 8 days | 8 days |
Shipping Method:
1. By DHL, UPS, FedEx, TNT using clients account
2. We suggest you using our DHL, UPS, FedEx, TNT forwarder
3. By EMS (Usually for Russia Clients), price is high
4. By sea for mass quantity according to customer's requirement
PCB Production Capability:
|
Files |
Gerber, Protel, Powerpcb, Autocad, Orcad, etc |
|
Material |
FR*4, Hi-Tg FR*4, Lead free Materials (RoHS Compliant) , FR1, CEM*3, CEM*1, Aluminium, High frequency Material (Rogers, Teflon, Taconic) |
|
Layer No. |
1 - *2 Layers |
|
Board thickness |
0.***5"(0.2mm)*0.**5"(3.2mm) |
|
Board Thickness Tolerance |
±*0% |
|
Copper thickness |
0.5OZ - 4OZ |
|
Impedance Control |
±*0% |
|
Warpage |
0.**5%*1.5% |
|
Peelable |
0.**2"(0.3mm)*0.*2’(0.5mm) |
|
Min Trace Width (a) |
0.**4"(0.1mm) |
|
Min Space Width (b) |
0.**4"(0.1mm) |
|
Min Annular Ring |
0.**4"(0.1mm) |
|
SMD Pitch (a) |
0.**2"(0.3mm) |
|
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) |
0.**7"(0.**5mm) |
|
Regesiter torlerance |
0.*5mm |
|
Min Solder Mask Dam (a) |
0.**5"(0.**5mm) |
|
Soldermask Clearance (b) |
0.**5"(0.**5mm) |
|
Min SMT Pad spacing (c) |
0.**4"(0.1mm) |
|
Solder Mask Thickness |
0.***7"(0.**8mm) |
|
Hole size |
0.**8"(0.*0mm)*- 0.**7"(6.5mm) |
|
Hole Size Tol (+/-) |
±0.**3"(±0.***2mm) |
|
Aspect Ratio |
*0:*1 |
|
Hole Registration |
0.**3"(0.**5mm) |
|
HASL |
2.5um |
|
Lead free HASL |
2.5um |
|
Immersion Gold |
Nickel **7um Au:**3u'' |
|
OSP |
0.**0.5um |
|
Panel Outline Tol (+/-) |
±0.**4''(±0.1mm) |
|
Beveling |
*0°*5° |
|
V-cut |
*5° *0° *5° *0° |
|
Surface finish |
HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink, |
|
Certificate |
ROHS ISO***1 TS****9 SGS UL |
|
Special requirements |
Buried&blind vias, Impedance control, via plug, BGA soldering and gold finger |
