I3-350M SLBPK By Lihua Industrial(HK) Limited, China
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I3-350M SLBPK

I3-350M SLBPK

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Minimum Order

Localité:

Malaysia

Prix de commande minimale:

-

Commande minimale:

5 Piece

Packaging Detail:

tray

Delivery Time:

within 2 business days after payment

Supplying Ability:

1000 Piece per Day

Payment Type:

Western Union, T/T

Contacter maintenant
Membre gratuit

Personne à contacter Ms. Joy

Room 1006,Shiyou Building,South of Huaqiang Road,Futian District, Shenzhen, Other

Contacter maintenant

Description


General information
Type CPU / Microprocessor
Market segment Mobile
Family Intel Core i3 Mobile
Model number  ?  i****0M
CPU part number CP**********1AC is an OEM/tray microprocessor
Frequency  ?  ***7 MHz
Low power frequency **3 MHz
Clock multiplier  ?  *7
Package ***-pin micro-FCPGA*0 (rPGA**8A)
Socket Socket G1 (rPGA**8A)
Size 1.*8" x 1.*8" / 3.*5cm x 3.*5cm
Weight 0.3oz / 7.7g
Introduction date January 7, ***0
 
S-spec numbers
  Production processors
Part number SLBPK SLBU5
CP**********1AC + +
 
Architecture / Microarchitecture
Microarchitecture Nehalem (Westmere)
Platform Calpella
Processor core  ?  Arrandale
Core steppings  ?  C2 (SLBPK)
K0 (SLBU5)
CPUIDs ****2 (SLBPK)
****5 (SLBU5)
Manufacturing process 0.**2 micron
**2 million transistors (CPU die)
**7 million transistors (IMC / graphics die)
Die size *1mm2 (CPU die)
**4mm2 (IMC / graphics die)
Data width *4 bit
The number of cores 2
The number of threads 4
Floating Point Unit Integrated
Level 1 cache size  ?  2 x *2 KB instruction caches
2 x *2 KB data caches
Level 2 cache size  ?  2 x **6 KB
Level 3 cache size Shared 3 MB
Cache latency 4 (L1 cache)
*1 (L2 cache)
*7 (L3 cache)
Multiprocessing Not supported
Features
  • MMX instruction set
  • SSE
  • SSE2
  • SSE3
  • Supplemental SSE3
  • SSE4.1  ? 
  • SSE4.2  ? 
  • EM*4T technology  ? 
  • Hyper-Threading technology  ? 
  • Virtualization technology  ? 
  • Execute Disable bit  ? 
Low power features
  • Thread C1, C3 and C6 states
  • Core C1/C1E, C3 and C6 states
  • Package C1/C1E, C3 and C6 states
  • Enhanced SpeedStep technology  ? 
On-chip peripherals
  • Integrated dual-channel DDR3 SDRAM Memory controller
  • Direct Media Interface
  • Integrated HD graphics controller
 
Electrical/Thermal parameters
V core  ?  0.8V - 1.4V (High Frequency mode)
0.**5V - 1V (Low Frequency mode)
Minimum/Maximum operating temperature  ?  0°C - *0°C
Maximum power dissipation  ?  *7.2 Watt (peak, CPU core only)
*4.8 Watt (sustained, CPU core only)
Thermal Design Power  ?  *5 Watt (Package)
*5 Watt (CPU core)
*2.5 Watt (Graphics core)

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To:

Ms. Joy < Lihua Industrial(HK) Limited >

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