FOB Price
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Minimum Order
Localité:
Malaysia
Prix de commande minimale:
-
Commande minimale:
5 Piece
Packaging Detail:
tray
Delivery Time:
within 2 business days after payment
Supplying Ability:
1000 Piece per Day
Payment Type:
Western Union, T/T
Personne àcontacter Ms. Joy
Room 1006,Shiyou Building,South of Huaqiang Road,Futian District, Shenzhen, Other
General information | ||||||||||
Type | CPU / Microprocessor | |||||||||
Market segment | Mobile | |||||||||
Family | Intel Core i3 Mobile | |||||||||
Model number ? | i****0M | |||||||||
CPU part number | CP**********1AC is an OEM/tray microprocessor | |||||||||
Frequency ? | ***7 MHz | |||||||||
Low power frequency | **3 MHz | |||||||||
Clock multiplier ? | *7 | |||||||||
Package | ***-pin micro-FCPGA*0 (rPGA**8A) | |||||||||
Socket | Socket G1 (rPGA**8A) | |||||||||
Size | 1.*8" x 1.*8" / 3.*5cm x 3.*5cm | |||||||||
Weight | 0.3oz / 7.7g | |||||||||
Introduction date | January 7, ***0 | |||||||||
S-spec numbers | ||||||||||
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Architecture / Microarchitecture | ||||||||||
Microarchitecture | Nehalem (Westmere) | |||||||||
Platform | Calpella | |||||||||
Processor core ? | Arrandale | |||||||||
Core steppings ? | C2 (SLBPK) K0 (SLBU5) |
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CPUIDs | ****2 (SLBPK) ****5 (SLBU5) |
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Manufacturing process | 0.**2 micron **2 million transistors (CPU die) **7 million transistors (IMC / graphics die) |
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Die size | *1mm2 (CPU die) **4mm2 (IMC / graphics die) |
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Data width | *4 bit | |||||||||
The number of cores | 2 | |||||||||
The number of threads | 4 | |||||||||
Floating Point Unit | Integrated | |||||||||
Level 1 cache size ? | 2 x *2 KB instruction caches 2 x *2 KB data caches |
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Level 2 cache size ? | 2 x **6 KB | |||||||||
Level 3 cache size | Shared 3 MB | |||||||||
Cache latency | 4 (L1 cache) *1 (L2 cache) *7 (L3 cache) |
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Multiprocessing | Not supported | |||||||||
Features |
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Low power features |
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On-chip peripherals |
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Electrical/Thermal parameters | ||||||||||
V core ? | 0.8V - 1.4V (High Frequency mode) 0.**5V - 1V (Low Frequency mode) |
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Minimum/Maximum operating temperature ? | 0°C - *0°C | |||||||||
Maximum power dissipation ? | *7.2 Watt (peak, CPU core only) *4.8 Watt (sustained, CPU core only) |
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Thermal Design Power ? | *5 Watt (Package) *5 Watt (CPU core) *2.5 Watt (Graphics core) |