Mobilephone 6-layer HDI pcb manufacturer By Shenzhen SunSoar Electrons CO., LTD, China
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Mobilephone 6-layer HDI pcb manufacturer

Mobilephone 6-layer HDI pcb manufacturer

FOB Price

Obtenir le dernier prix

1 ~ 50 / Piece

|

Minimum Order

Localité:

China

Prix de commande minimale:

Commande minimale:

1 Piece

Packaging Detail:

Inner:vacuum packaging; Outer:carton

Delivery Time:

3-5Days

Supplying Ability:

100000 Square Meter per Month

Payment Type:

Other, PayPal, Money Gram, Western Union, L/C, T/T

Contacter maintenant
Shenzhen SunSoar Electrons CO., LTD

Shenzhen SunSoar Electrons CO., LTD

China

Membre gratuit

Personne à contacter Ms. Sabrina

baoan, Shenzhen, Other

Contacter maintenant

Description

Special futures · Thickness: 1.6mm · Application: Mobilephone
· Minimum trace size: 0.1mm · Minimum drill: 0.*5mm · With blind and buried holes · Layers: 1 to 28 · Board finished thicknesses: 0.2 to 7.0mm · Materials: FR*4, CEM-1, high Tg, halogen-free, Roger,F4B, Aluminum base,*4V0, *4HB · Maximum finished board size: 550 x *1*0mm · Minimum hole size: 4mil (0.1mm) · Minimum trace width/space: 3.5/3.5mil · Surface finishes/treatments: HASL, lead-free HASL, immersion gold, gold plating, immersion silver, immersion tin and OSP · Copper thicknesses: 0.5 to 6oz · Solder mask colors: green, yellow, black, white, red and blue · Copper thickness in hole: >*8um · Inner packaging: plastic bag (vacuum packing) · Outline tolerance: Â±0.*3mm · Hole size tolerance: (PTH) Â±0.**6 and (NPTH) Â±0.*5mm · With UL and ROHS marks · Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger · Profiling: punching, routing, V-cut and beveling · OEM services to all sorts of printed circuit board assembly as well as electronic encased products are provided

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To:

Ms. Sabrina < Shenzhen SunSoar Electrons CO., LTD >

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