Description
Produce capability
Layers: 1 to *2
Board finished thicknesses: 0.2 to 7.0mm
Materials: FR*4, CEM*3, high TG, halogen-free FR4 and Rogers
Maximum finished board size: **0 x **0mm
Minimum hole size: *-mil (0.1mm)
Minimum trace width/space: 3.5/3.*-mil
Surface finishes/treatments: HASL, lead-free HASL, immersion gold,
gold-plating, immersion silver, immersion tin and OSP
Copper thicknesses: 0.5 to 6oz
Solder mask colors: green, yellow, black, white, red and blue
Copper thickness in hole:
