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Personne àcontacter Ms. Joy
3F Building B, Huangtian Brightway Industrial Park, Xixiang, Baoan District, Shenzhen, Guangdong
Specification: Upper heater: hot-air **0W Lower heater: hot-air **0W Bottom preheatfar infrared: ***0W Power supply: single-phase **0V, *0/*0Hz, 4.5KW Workable PCB dimension: W*0xD*0~W**0xD**0mm Workable PCB thickness: 0.5mm ~ 3mm Workable BGA dimension: 1x1mm ~ *0x*0mm Min pitch of BGA ball: 0.*5mm Placement precisionï&frac*4;Å¡0.*1mm Max.BGA weight: **0g Machine dimension: L**0×W**0×H**0mm Weight: Appox. **0Kgs Description * The movable heating head is easy to operate; hot air head and mounting head are manually controlled; PCB sliding rack is micro-adjustable with X and Y ases; * Color optical system with functions such as spilt vision, zoom-in and micro-adjust, autofocus and menu operation, equipped with aberration detection device; * Embedded industrial computer can analyze the two practically-tested profiles, and compare them with the history saved profiles;profile saving no limit for the industrial computer * Color LCD monitor, touch screen interface; * Three heaters heating independently, both upper and lower heater can control multi stages on the profile simultaneously, large bottom IR heating area to heat PCB evenly; temperature, time, rate, cooling and alarm events are all displayed on the touch screen; * Over-heating protection for the hot air heating head; temperature of hot air in the upper and infrared at the bottom is program controllable; 6segments of temperature up(down) and 6 segments constant temperature control, profile saving is unlimited in the industrial computer; profile analysis can be carried out on the touch screen; with computer communication function as computers, with communication software attached; with temperature measurement function; * The supports for the BGA soldering supporting frame are micro-adjustable to restrain local sinkage in the soldering area; * Built-in vacuum