8 layers PCB For Mobile Phone By Dawn Technologies (HK) Limited, China
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8 layers PCB For Mobile Phone

8 layers PCB For Mobile Phone

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Dawn Technologies (HK) Limited

Dawn Technologies (HK) Limited

China

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Personne à contacter Mr. Huang

No.205, Hongdu Office Building, Fanshen Road, ShenZhen, Guangdong

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Description

Key Specifications/Special Features: Layer No.: 8 Surface finished: ENIG + OSP Board thickness: 1.0mm Array size: 9.**6 x 4.**0 inches Thru via size: 0.*0mm Application: mobile phone HDI structure: 1 + 6 + 1 Min. BGA ball pitch: **0um Min. SMD pad pitch: **0um Material type: FR4, HTG Min. line width: **0um Min. line space: **0um

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