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Personne àcontacter Ms. Sally
kaifu disturict, Changsha, Hunan
The base layer is tungsten or moly-manganese, screen printed with a minimum layer thickness of 6 µm. An electrolytic nickel layer (approximately 2 µm) assures a good solder flow. Other thicknesses are available for specific customer requirements. Electrolytic nickel plating requires electrical connections for the plating process. Special design guidelines will therefore apply wherever an electrolytic technique is involved. An optional gold flash layer (approximately 0, 1 µm) may be added to enhance corrosion resistance. As a further option, the electrolytic nickel layer may be covered with a bondable gold plating. Solder finishes are also available.
