Wafer Thinning and Backside Coating service By Phoenix Silicon International Corp, Taiwan
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Wafer Thinning and Backside Coating service

Wafer Thinning and Backside Coating service

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Phoenix Silicon International Corp

Phoenix Silicon International Corp

Taiwan

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Personne à contacter Mr. Maoee

6 Lishin Rd, SBIP, Hsinchu, Taiwan

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Description

We offer wafer thinning and backside coating service for 6" (**0mm) and 8" (**0mm) wafers. We can thin the wafer down to **0 microns on batch. The coating metals can be Ti/Ni/Au or Ti/Ni/Ag or other metal films as requested. Coating thickness from **0 Angstrom to *0,**0 angstrom for each metal film.

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