La description

Standard FPC from Multek is utilized extensively in a wide variety of electronic assemblies from simple antennas to complex control circuitry. Standard FPC includes single and double layer flexible circuits built on adhesive based polyester (“PET” / “PEN”) or polyimide (PI) film substrates with copper thicknesses ranging from *8um to **0um. These circuits can be provided in single pieces, multiple up arrays, or in rolls. 

Key Capabilities: 

Single or double-sided circuitry
Adhesive-based and adhesiveless constructions
PET, PEN or PI film substrates
Low-cost, roll-to-roll manufacturing
Screen print imaging with minimum conductor pitch at 0.*0mm
Photo imaging with minimum conductor pitch at 0.*5mm
Screened inks, photo imageable soldermasks, or laminated coverfilm dielectrics
Surface finishes include anti-tarnish. immersion silver, tin, solder, electroplated nickel/gold and ENIG
Various support materials can be selectively added including: metal heatsinks, film stiffeners,
FR4/CEM1/G*0 rigidizers, molded plastic assemblies, and EMI shielding