Prix FOB
Obtenir le dernier prix( Negotiable )
|1 Unit Minimum Order
Pays:
China
N ° de modèle:
-
Prix FOB:
( Negotiable ) Obtenir le dernier prix
Localité:
-
Prix de commande minimale:
-
Commande minimale:
1 Unit
Packaging Detail:
WLCSP
Heure de livraison:
15days
Capacité de Fournir:
-
Payment Type:
T/T
Groupe de produits :
-
Personne àcontacter 蕾
Shenzhen, Guangdong
Benefits
• Allows testing of RF devices at the wafer-level
• Adaptable to wafer-level probing and singulated device testing for debug and characterization
• Long life and extended maintenance intervals
• Engineering analysis of WLCSP devices or KGD
• Consistently high test yields
• Maximum mechanical operating window to overcome z-stack non-coplanarity
Key Features
• Low loop inductance and high bandwidth
• Device pitches down to **0 µm
• Variety of contact and body materials to optimize performance
• Manual actuation of singulated devices • Low and stable contact resistance
• Individual probe compliance with large mechanical overdrive
| Pays: | China |
| N ° de modèle: | - |
| Prix FOB: | ( Negotiable ) Obtenir le dernier prix |
| Localité: | - |
| Prix de commande minimale: | - |
| Commande minimale: | 1 Unit |
| Packaging Detail: | WLCSP |
| Heure de livraison: | 15days |
| Capacité de Fournir: | - |
| Payment Type: | T/T |
| Groupe de produits : | - |
